氩气气压对磁控溅射镀膜厚度与均匀性的影响
程义卫, 黄煌, 薛亚斌, 杨磊, 裴子栋
中国工程物理研究院材料研究所
通信作者: 裴子栋 (1986-), 博士, 高级工程师, 主要从事金属材料表面改性研究, 邮箱: nkpzd@163.com
The Influence of Ar Pressure on the Film Thickness and Uniformity of Magnetron Sputtering
CHENG Yiwei, HUANG Huang, XUE Yabin, YANG Lei, PEI Zidong
Institute of Materials, China Academy of Engineering Physics
Corresponding Author: PEI Zidong (1986-), Ph.D., Senior Engineer, Research Focus: Surface Modification of Metallic Materials, E-mail: nkpzd@163.com
文章历史: 收稿日期: 2026-03-02
摘 要
研究异形工件镀膜均匀性十分重要。为此，采用磁控溅射技术在曲面工件表面制备了铝镀层，通过增重法、台阶仪等手段研究了不同氩气气压（0.3、0.6、0.9、1.2 Pa）条件下的镀层平均厚度及不同位置的厚度均匀性。实验结果表明：镀层厚度受氩气气压的影响较大。在实验条件下，镀层平均厚度与厚度均匀性随着气压的增大均先增大后减小，在0.6 Pa附近存在最大值；外形面不同位置处的镀层厚度随着气压的增大先增大后减小；内形面不同位置处的镀层厚度随着气压的增大而减小。对该结果通过物理模型进行了仿真验证。仿真与实际均证明了曲面工件上不同位置的沉积速率随气压的变化规律不是一致的。气压对曲面不同位置沉积速率具有差异化影响的主要原因是气压通过调控分子平均自由程和碰撞频率影响沉积行为，而复杂结构工件相较于简单平面基体的边界条件（靶基距、入射角度）一致性更差，因此更难获得均匀性较高的薄膜。研究成果可以为曲面工件磁控溅射镀膜工艺气压的选择提供一定的指导。
Abstract
It is of great significance to investigate the coating uniformity of special-shaped workpieces. In this paper, an aluminum coating was deposited on the surface of curved workpieces by magnetron sputtering technology. The average coating thickness and thickness uniformity at different positions were systematically studied under different argon pressures (0.3, 0.6, 0.9 and 1.2 Pa) via the weight gain method, profilometer and other characterization methods. The experimental results showed that film mean thickness and local thickness were affected obviously by Ar pressure. Under the experimental conditions, film mean thickness and uniformity first increased and then decreased with the increase of Ar pressure. The maximum value was obtained at Ar pressure about 0.6 Pa. Film thickness at different positions of outside surface first increased and then decreased with the increase of Ar pressure. Film thickness at different positions of inside surface decreased with the increase of Ar pressure. The results were verified by physical simulation. Both simulation and practice had proved that the deposition rate varied with the Ar pressure at different positions on shell shaped workpieces was not consistent. The main reason for the differential effect of Ar pressure on the deposition rate at different positions on a curved surface was that Ar pressure affected the deposition behavior by regulating the average free path and collision frequency of molecules. Compared to simple planar substrates, complex structured workpieces had poorer consistency in boundary conditions (target substrate distance, incident angle), making it more difficult to obtain thin films with higher uniformity. This paper could provide guidance on the choice of Ar pressure in magnetron sputtering process.
关键词
磁控溅射; 曲面工件; 氩气气压; 镀层厚度; 厚度均匀性; 物理仿真
Keywords
magnetron sputtering; curved workpiece; Ar pressure; film thickness; uniformity; physical simulation
引用文本
程义卫, 黄煌, 薛亚斌, 等. 氩气气压对磁控溅射镀膜厚度与均匀性的影响[J]. 表面工程与再制造, 2026, 26(2): 22-29. DOI:10.26935/j.issn.2097-5317.2026.0008.
CHENG Yiwei, HUANG Huang, XUE Yabin, et al. The Influence of Ar Pressure on the Film Thickness and Uniformity of Magnetron Sputtering[J]. Surface Engineering & Remanufacturing, 2026, 26(2): 22-29. DOI:10.26935/j.issn.2097-5317.2026.0008.
中图分类号
TG174.4
基金项目
无
实验研究
