无氰电镀金合金的研究进展

李沛妍, 廖敏仪, 肖念慈, 李善完美, 杨富国, 陈晓娟

佛山大学环境与化工学院
通信作者: 杨富国 (1964-), 博士, 教授, 研究领域: 电化学, E-mail: 180858383@qq.com

Research Progress in Cyanide-Free Electroplating of Gold Alloy

LI Peiyan, LIAO Minyi, XIAO Nianci, LI Shanwanmei, YANG Fuguo, CHEN Xiaojuan

School of Environment and Chemical Engineering, Foshan University
Corresponding Author: YANG Fuguo (1964-), Ph.D., Professor, Research Focus: Electrochemistry, E-mail: 180858383@qq.com

文章历史: 收稿日期: 2026-01-07

摘    要
金合金镀层具有良好的耐腐蚀性、抗氧化性、导电性及耐磨性，广泛应用于精饰加工等领域。电化学镀金合金是实现精饰加工镀金合金的主要工艺之一，主要分为有氰镀金合金工艺和无氰镀金合金工艺。相较于有氰镀金合金工艺，无氰镀金合金工艺可通过控制配位剂浓度、镀液温度、pH值及电流密度等工艺参数，灵活调控镀层的物理化学性能。近年来，国内外在精饰加工用无氰镀金合金工艺领域开展了系列研究工作，并取得了较好进展。综述了电化学镀金合金的基本原理，描述了电镀金合金过程中金由离子形态转化为金属的过程。此外，还综述了几种常见无氰电镀金合金(金-钴、金-镍、金-铜、金-锡)工艺的镀液组成、操作参数及应用领域。同时，对比介绍了无氰与有氰2类典型镀液制备金合金镀层的基本情况，分析了各自优缺点：有氰镀液稳定性好，所得金合金镀层均匀；无氰镀液突出优势为无毒环保，但稳定性仍有待进一步提高。最后，展望了无氰镀金合金工艺的发展方向，可为新型无氰镀金合金工艺开发及应用拓展提供有益参考与启示。

Abstract
Gold is widely used in electronic products and decorative products. Its stable chemical properties can not only play an important role in the protection of the substrate, golden color also has a decorative function. As a precious metal, gold has stable physical and chemical properties and wide range of applications in industrial fields. Therefore, the gold alloy plating layer has good corrosion resistance, oxidation resistance, electrical conductivity and wear resistance, which is widely used in the metal finishing. At present, electrochemical plating is one of the main processes for the realization of gold alloy plating on metal. On the basis of potential or current applying mode, the electrochemical plating can be mainly divided into cyanide plating process and cyanide-free plating process. Compared with the cyanide plating process, cyanide-free plating process can regulate the electrochemical and concentration polarization of metal ions during electrodeposition process by controlling several technological parameters, such as concentration of complexing agent, temperature of plating solution, pH and current density. As a result, the physical and chemical properties of gold alloy plating layer on metal can be flexibly adjusted during the cyanide-free plating process. In the past years, a series of research works have been carried out and reported in the field of gold alloy plating for the cyanide-free plating process. Among them, some of impressive progresses in the gold alloy plating process have been achieved. It is necessary to summarize the recent advancements in gold alloy plating process to guide future research. In this review, the basic principle of electrochemical electroplating was introduced, and the process of gold transformation from ionic form to metal in gold electroplating experiment was described emphatically. The effect of pulse parameters(such as duty cycle, frequency, current density, turn on-time, turn off-time) on the formation of gold nucleus and gold plating layer was presented. In addition, some of commonly used methods for the evaluation of gold plating layer performance on metal. Furthermore, several types of composition, operation parameter and application field for cyanide-free gold alloy electroplating, such as gold-cobalt, gold-nickel, gold-copper and gold-stannum, were presented in detail. In particular, the merits and demerits of gold alloy plating process using cyanide plating solution or cyanide-free plating solution were summarized. The main performance was that cyanide plating solution had good stability, and the gold alloy plating layer obtained was uniform, while cyanide-free plating solution had the outstanding advantage of non-toxicity, but its stability should be further improved. Cyanide, which is used on a large scale in industrial gold plating production, poses a great threat to the environment, operators and social safety in its production, transportation and use. Carrying out research on the mechanism of gold electrodeposition and developing novel cyanide-free gold electrodeposition tecnnology is in line with the common requirements of the country, society, environment and enterprises, which has important theoretical and practical significance. Based on the consideration of green development, an outlook about the gold alloy plating in cyanide-free solutions was finally presented to enlighten the future direction of gold alloy plating process. The present review can provide useful reference and enlightenment for the development of gold alloy plating process and applications.

关键词
金合金; 无氰电镀; 综述; 工艺参数; 镀液

Keywords
gold alloy; cyanide-free electroplating; review; process parameters; plating solution

引用文本
李沛妍, 廖敏仪, 肖念慈, 等. 无氰电镀金合金的研究进展[J]. 表面工程与再制造, 2026, 26(1): 31-37. DOI:10.26935/j.issn.2097-5317.2026.0004.

LI Peiyan, LIAO Minyi, XIAO Nianci, et al. Research Progress in Cyanide-Free Electroplating of Gold Alloy[J]. Surface Engineering & Remanufacturing, 2026, 26(1): 31-37. DOI:10.26935/j.issn.2097-5317.2026.0004.

中图分类号
TQ153

基金项目
2022年广东省科技创新战略专项基金 (pdjh2022b0549)

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